TY - GEN
T1 - Design and implementation of multi-octave low-noise power amplifier (LNPA) using HIFET configuration
AU - Chiang, Che Yang
AU - Hsu, Heng-Tung
PY - 2012/12/1
Y1 - 2012/12/1
N2 - This paper reports an low-noise-power amplifier (LNPA) MMIC using HIFET (High-Voltage, High-Impedance FET) configuration with very broadband performance in terms of noise figure, output power and linearity. Based on 0.15μm pHEMT technology, this MMIC delivers a gain of 12.5 ± 1dB, 1.5 ∼ 2.5 dB noise figure (NF), good impedance match with S11/S22 less than -10 dB, and over 15 dBm of output P1dB covering the entire 2 GHz to 13 GHz with 25% peak efficiency, at a bias voltage of 4 V. The proposed LNPA also demonstrates excellent thermal stability. The measured thermal-sensitivity coefficient for the small-signal gain is as low as 0.0144 dB/°C with respect to the temperature variation from -30°C to 150°C. The overall chip area is as small as 0.93 mm2 excluding test pads.
AB - This paper reports an low-noise-power amplifier (LNPA) MMIC using HIFET (High-Voltage, High-Impedance FET) configuration with very broadband performance in terms of noise figure, output power and linearity. Based on 0.15μm pHEMT technology, this MMIC delivers a gain of 12.5 ± 1dB, 1.5 ∼ 2.5 dB noise figure (NF), good impedance match with S11/S22 less than -10 dB, and over 15 dBm of output P1dB covering the entire 2 GHz to 13 GHz with 25% peak efficiency, at a bias voltage of 4 V. The proposed LNPA also demonstrates excellent thermal stability. The measured thermal-sensitivity coefficient for the small-signal gain is as low as 0.0144 dB/°C with respect to the temperature variation from -30°C to 150°C. The overall chip area is as small as 0.93 mm2 excluding test pads.
KW - Low-noise amplifiers
KW - microwave devices
KW - microwave power FET amplifiers
KW - radiofrequency amplifiers
UR - http://www.scopus.com/inward/record.url?scp=84874421470&partnerID=8YFLogxK
U2 - 10.1109/APMC.2012.6421790
DO - 10.1109/APMC.2012.6421790
M3 - Conference contribution
AN - SCOPUS:84874421470
SN - 9781457713309
T3 - Asia-Pacific Microwave Conference Proceedings, APMC
SP - 956
EP - 958
BT - 2012 Asia-Pacific Microwave Conference, APMC 2012 - Proceedings
T2 - 2012 Asia-Pacific Microwave Conference, APMC 2012
Y2 - 4 December 2012 through 7 December 2012
ER -