TY - JOUR
T1 - Design and fabrication of CD-like microfluidic platforms for diagnostics
T2 - Polymer-based microfabrication
AU - Lee, James
AU - Madou, Marc J.
AU - Koelling, Kurt W.
AU - Daunert, Sylvia
AU - Lai, Siyi
AU - Koh, Guan
AU - Juang, Yi Je
AU - Lu, Yumin
AU - Yu, Liyong
N1 - Funding Information:
The authors wish to thank Lynn Kim and Yihfar Chen at Burstein Technologies Inc. for their assistance on making DRIE mold. This work is supported by NASA, NSF (DMI-0084919), and the NSF Centers for Advanced Polymer and Composite Engineering (CAPCE) and Industrial Sensors and Measurements (CISM) at The Ohio State University.
PY - 2001
Y1 - 2001
N2 - Several microfabrication methods for polymer-based CD microfluidic platforms are presented in this paper. For prototyping, both traditional CNC-machining and photolithography techniques were used. For mass production, mold inserts were made by CNC-machining of tool steel and LIGA-like processes such as UV photolithography, photolithography/electroplating, and photolithography/deep reactive ion etching (DRIE). Several molding methods were tried, including liquid resin casting, thin wall injection molding, and hot embossing. Advantages and disadvantages of each method are explained. Plastic bonding for microfluidic platforms is also briefly discussed.
AB - Several microfabrication methods for polymer-based CD microfluidic platforms are presented in this paper. For prototyping, both traditional CNC-machining and photolithography techniques were used. For mass production, mold inserts were made by CNC-machining of tool steel and LIGA-like processes such as UV photolithography, photolithography/electroplating, and photolithography/deep reactive ion etching (DRIE). Several molding methods were tried, including liquid resin casting, thin wall injection molding, and hot embossing. Advantages and disadvantages of each method are explained. Plastic bonding for microfluidic platforms is also briefly discussed.
KW - CNC-machining
KW - Deep reactive ion etching
KW - Electroplating
KW - Hot embossing
KW - Liquid resin casting
KW - Microfabrication
KW - Photolithography
KW - Thin wall injection molding
UR - http://www.scopus.com/inward/record.url?scp=0035193392&partnerID=8YFLogxK
U2 - 10.1023/A:1012469017354
DO - 10.1023/A:1012469017354
M3 - Article
AN - SCOPUS:0035193392
SN - 1387-2176
VL - 3
SP - 339
EP - 351
JO - Biomedical Microdevices
JF - Biomedical Microdevices
IS - 4
M1 - 381088
ER -