Design and Fabrication of A Sub-THz Co-Reflectively Curved Patch-Reflector Antenna Array for Gain Enhancement and Near Field Focusing

Ching Jen Lee, Pin Cheng Tseng, Wei Chian Wang, Yun Hao Liou, Yu Ting Cheng*, Chien Nan Kuo

*此作品的通信作者

研究成果: Conference contribution同行評審

1 引文 斯高帕斯(Scopus)

摘要

This paper presents a sub-THz co-reflectively curved patch-reflector antenna array, which is a co-reflecting surface stage made by 3D stereolithography-SLA printing technology to integrate a 160 GHz, 1x4 curved patch antenna array. The co-reflecting surface stage is applied for supporting the patch antenna array made of a micromachined flexible Kapton substrate to achieve gain enhancement and near-field focusing functions. In the near-field measurement of the antenna array, - 9.34 dBm@ 160 GHz signal power is measured at a 3 mm distance to the patch array, which is consistent with the simulation results. According to the simulation results, the co-reflecting antenna array can accomplish an antenna gain of 13.3 dB, an increase of 2.4dB as compared to that without co-reflection surface design for far-field radiation. In addition, for a -19dBm power input into the antenna array, a maximum radiated energy of -11.95 dBm with 82% half-radiated energy area reduction at a distance of 4 mm to the patch array and depth of focus (DOF) of 3.05 mm can be obtained indicating the proposed antenna scheme can exhibit near-field focusing ability.

原文English
主出版物標題Proceedings - IEEE 73rd Electronic Components and Technology Conference, ECTC 2023
發行者Institute of Electrical and Electronics Engineers Inc.
頁面504-509
頁數6
ISBN(電子)9798350334982
DOIs
出版狀態Published - 2023
事件73rd IEEE Electronic Components and Technology Conference, ECTC 2023 - Orlando, United States
持續時間: 30 5月 20232 6月 2023

出版系列

名字Proceedings - Electronic Components and Technology Conference
2023-May
ISSN(列印)0569-5503

Conference

Conference73rd IEEE Electronic Components and Technology Conference, ECTC 2023
國家/地區United States
城市Orlando
期間30/05/232/06/23

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