@inbook{0a22cb0219374a6fb47952d8e951bea5,
title = "Defect Pattern Analysis, Yield Learning Modeling, and Yield Prediction",
abstract = "After wafer fabrication, many defects may spread across the surface of a wafer. There may be multiple defects on a die.",
author = "Chen, {Tin Chih Toly}",
note = "Publisher Copyright: {\textcopyright} 2023, The Author(s), under exclusive license to Springer Nature Switzerland AG.",
year = "2023",
doi = "10.1007/978-3-031-14065-5_4",
language = "English",
series = "SpringerBriefs in Applied Sciences and Technology",
publisher = "Springer Science and Business Media Deutschland GmbH",
pages = "63--76",
booktitle = "SpringerBriefs in Applied Sciences and Technology",
address = "德國",
}