Decomposition of trimethyl indium on Si (111)-7 × 7 studied with XPS, UPS and HREELS

Y. Bu*, Jason C.S. Chu, Ming-Chang Lin

*此作品的通信作者

研究成果: Article同行評審

13 引文 斯高帕斯(Scopus)

摘要

The techniques of XPS, UPS and HREELS are utilized to investigate the thermal decomposition of trimethyl indium (TMIn) on Si (111) -7 × 7. At 120 K, TMIn was primarily molecularly adsorbed on the surface. As the sample was annealed at higher temperatures, species such as CH3, CH2, In, C and H, etc., were identified. At temperatures above 950 K, SiC was the only species detected.

原文English
頁(從 - 到)207-213
頁數7
期刊Materials Letters
14
發行號4
DOIs
出版狀態Published - 1 1月 1992

指紋

深入研究「Decomposition of trimethyl indium on Si (111)-7 × 7 studied with XPS, UPS and HREELS」主題。共同形成了獨特的指紋。

引用此