Decomposable Architecture and Fault Mitigation Methodology for Deep Learning Accelerators

Ning Chi Huang*, Min Syue Yang, Ya Chu Chang, Kai Chiang Wu

*此作品的通信作者

研究成果: Conference contribution同行評審

1 引文 斯高帕斯(Scopus)

摘要

As the demand for data analysis increases rapidly, artificial intelligence (AI) models have been developed for various applications. Many deep neural networks are presented with millions or billions of parameters and operations for AI computation. Therefore, many AI accelerators apply pipelined architectures with simple but dense computational elements for numerous operations. However, manufacturing-induced faults cause a challenge to computational robustness or yield degradation on those AI accelerators. In this paper, we propose a fault mitigation methodology based on decomposable systolic arrays. By leveraging the inherent error resilience of AI applications, our data arrangement can reduce the difference between accurate results and faulty results. Additionally, utilizing both our proposed data arrangement and sign compensation can further mitigate the influence of faults in AI accelerators. In the experiments, our proposed fault mitigation methodology can maintain the application accuracy at a certain level, which outperforms state-of-the-art methods. When 0.1% of multiplier-accumulators are faulty in a systolic array, the array with our proposed fault mitigation methodology can have less than 0.5% accuracy loss while executing ResNet-18 for ImageNet classification.

原文English
主出版物標題Proceedings of the 24th International Symposium on Quality Electronic Design, ISQED 2023
發行者IEEE Computer Society
ISBN(電子)9798350334753
DOIs
出版狀態Published - 2023
事件24th International Symposium on Quality Electronic Design, ISQED 2023 - San Francisco, 美國
持續時間: 5 4月 20237 4月 2023

出版系列

名字Proceedings - International Symposium on Quality Electronic Design, ISQED
2023-April
ISSN(列印)1948-3287
ISSN(電子)1948-3295

Conference

Conference24th International Symposium on Quality Electronic Design, ISQED 2023
國家/地區美國
城市San Francisco
期間5/04/237/04/23

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