摘要
The effects of material flow, heat transfer, part geometry, and curing agents on the cure of sheet molding compounds (SMC) in molds with substructures were analyzed both experimentally and numerically. It was found that heat transfer during mold filling has a profound effect on the cure pattern, especially for fastcure resins molded for parts with thin dimensions.
| 原文 | English |
|---|---|
| 頁（從 - 到） | 740-748 |
| 頁數 | 9 |
| 期刊 | Polymer Engineering & Science |
| 卷 | 29 |
| 發行號 | 11 |
| DOIs | |
| 出版狀態 | Published - 6月 1989 |