Cure analysis of 'fast-cure' Sheet Molding Compounds (SMC)

J. D. Fan*, L. J. Lee

*此作品的通信作者

研究成果: Conference article同行評審

摘要

In this study, the cure behavior of fast-cure SMC (Sheet Molding Compound) is analyzed by a series of experiments and model simulation. A model was used that assumed that the SMC reaction can be described as a combination of three steps: initiation, inhibition, and propagation. Reaction starts only after the number of initiator radicals created is equal to the effective number of inhibitor molecules initiatlly present. It was found that a SMC compound must be designed in such a way that no cure reaction may occur during mold filling. During mold filling, heat transfer from the mold to the charge may result in a non-uniform temperature distribution which in turn may generate a non-uniform consumption of inhibitors at different locations. This can be readily analyzed by incorporating the decomposition rate of curing agents in the flow simulation and calculating the distributions of temperature and curing agents concentration during mold filling. The results at the end of mold filling can be used as the initial conditions for the cure analysis.

原文English
頁(從 - 到)978-983
頁數6
期刊Annual Technical Conference - Society of Plastics Engineers
出版狀態Published - 1989
事件ANTEC 89 - 47th Annual Technical Conference of SPE - New York, NY, USA
持續時間: 1 5月 19894 5月 1989

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