Continually-Adapted Margin and Multi-Anchor Distillation for Class-Incremental Learning

Yi Hsin Chen*, Dian Shan Chen*, Ying Chieh Weng, Wen Hsiao Peng, Wei Chen Chiu

*此作品的通信作者

研究成果: Conference contribution同行評審

摘要

This paper addresses the problem of class-incremental learning. The model is trained to recognize the classes added incrementally. It thus suffers from the challenging issue of catastrophic forgetting. Stemming from the knowledge distillation idea of attempting to retain the model's knowledge on seen classes while learning the newly-added ones, we advance to further alleviate the catastrophic forgetting via our proposed multi-anchor distillation objective, which is realized by constraining the spatial relationship between the input data and the multiple class embeddings of each seen class in the feature space while training the model. Moreover, since the knowledge distillation for incremental learning generally relies on keeping a replay buffer to store the samples of seen classes, the buffer of limited size brings another issue of class imbalance: the number of samples from each seen class decreases gradually, thus being much smaller than the number of samples from each new class. We therefore propose to introduce the continually-adapted margin into the classification objective for tackling the prediction bias towards new classes caused by the class imbalance. Experiments are conducted on various datasets and settings to demonstrate the effectiveness and superior performance of our proposed techniques in comparison to several state-of-the-art baselines.

原文English
主出版物標題2023 IEEE International Conference on Systems, Man, and Cybernetics
主出版物子標題Improving the Quality of Life, SMC 2023 - Proceedings
發行者Institute of Electrical and Electronics Engineers Inc.
頁面920-927
頁數8
ISBN(電子)9798350337020
DOIs
出版狀態Published - 2023
事件2023 IEEE International Conference on Systems, Man, and Cybernetics, SMC 2023 - Hybrid, Honolulu, United States
持續時間: 1 10月 20234 10月 2023

出版系列

名字Conference Proceedings - IEEE International Conference on Systems, Man and Cybernetics
ISSN(列印)1062-922X

Conference

Conference2023 IEEE International Conference on Systems, Man, and Cybernetics, SMC 2023
國家/地區United States
城市Hybrid, Honolulu
期間1/10/234/10/23

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