@inproceedings{686d499a85ed4eaf968dd7c4b8439df9,
title = "Continually-Adapted Margin and Multi-Anchor Distillation for Class-Incremental Learning",
abstract = "This paper addresses the problem of class-incremental learning. The model is trained to recognize the classes added incrementally. It thus suffers from the challenging issue of catastrophic forgetting. Stemming from the knowledge distillation idea of attempting to retain the model's knowledge on seen classes while learning the newly-added ones, we advance to further alleviate the catastrophic forgetting via our proposed multi-anchor distillation objective, which is realized by constraining the spatial relationship between the input data and the multiple class embeddings of each seen class in the feature space while training the model. Moreover, since the knowledge distillation for incremental learning generally relies on keeping a replay buffer to store the samples of seen classes, the buffer of limited size brings another issue of class imbalance: the number of samples from each seen class decreases gradually, thus being much smaller than the number of samples from each new class. We therefore propose to introduce the continually-adapted margin into the classification objective for tackling the prediction bias towards new classes caused by the class imbalance. Experiments are conducted on various datasets and settings to demonstrate the effectiveness and superior performance of our proposed techniques in comparison to several state-of-the-art baselines.",
author = "Chen, {Yi Hsin} and Chen, {Dian Shan} and Weng, {Ying Chieh} and Peng, {Wen Hsiao} and Chiu, {Wei Chen}",
note = "Publisher Copyright: {\textcopyright} 2023 IEEE.; 2023 IEEE International Conference on Systems, Man, and Cybernetics, SMC 2023 ; Conference date: 01-10-2023 Through 04-10-2023",
year = "2023",
doi = "10.1109/SMC53992.2023.10393943",
language = "English",
series = "Conference Proceedings - IEEE International Conference on Systems, Man and Cybernetics",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "920--927",
booktitle = "2023 IEEE International Conference on Systems, Man, and Cybernetics",
address = "United States",
}