Comparison of Organic and Inorganic Dielectric Hybrid Bonding with Highly <111>-Oriented Nanotwinned Cu

Pin Syuan He*, Chih Chen

*此作品的通信作者

研究成果: Conference contribution同行評審

摘要

Cu hybrid joints have appeared to be the solution for fine-pitch advanced packaging. A multitude of options are available for selecting dielectric materials for the hybrid bonding, which includes SiO2, SiCN and polymer dielectrics, and all the materials have their pros and cons. In this paper, we have examined low-thermal-budget (≦220 °C), high bonding strength (≧ 30 MPa) and low contact resistance (< 1.7 × 10-8 Ω•cm2) hybrid bonding without a post-bond annealing process via film-to-film bonding with low-curing-temperature polyimide, PI, and die-to-die hybrid bonding with low-curing-temperature polyimide and highly <111>-oriented nanotwinned Cu, NT-Cu; and compared it to inorganic hybrid bonding in previous literature. The thermal properties of NT-Cu and the surrounding dielectric need to be compatible with each other to achieve the best bonding quality and lowest cost. NT-Cu can be bonded and even eliminate the bonding interface at 150~250 °C within 1 h, while the inorganic dielectrics need post-bond annealing process to eliminate the seams for at least 1~4 h at 200~350 °C. As for low-curing-temperature PI, bonding can be achieved, and its interface can be eliminated at only 100 °C for 30 min and even lower. It also possesses low dielectric constants, processing simplicity, strong mechanical properties, great thermal stability, and very low process cost, making NT-Cu/PI a potential new choice for 3D IC hybrid bonding.

原文English
主出版物標題Proceedings - IEEE 74th Electronic Components and Technology Conference, ECTC 2024
發行者Institute of Electrical and Electronics Engineers Inc.
頁面1998-2002
頁數5
ISBN(電子)9798350375985
DOIs
出版狀態Published - 2024
事件74th IEEE Electronic Components and Technology Conference, ECTC 2024 - Denver, United States
持續時間: 28 5月 202431 5月 2024

出版系列

名字Proceedings - Electronic Components and Technology Conference
ISSN(列印)0569-5503

Conference

Conference74th IEEE Electronic Components and Technology Conference, ECTC 2024
國家/地區United States
城市Denver
期間28/05/2431/05/24

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