Comparison of Different Copper Nitride Passivation Layers Fabrication Methodology and Optimal Growth Condition for Low Temperature Copper-to-Copper Bonding in Advanced Packaging

Chiao Yen Wang, Tzu Heng Hung, Ping Jung Liu, Kuan Neng Chen*

*此作品的通信作者

研究成果: Conference contribution同行評審

摘要

Given the growing demand for heterogeneous integration, achieving low-temperature copper-to-copper bonding has become a pivotal technique. In the context of this bonding technique, the deposition of a passivation layer on metallic interconnects has been demonstrated to enhance bonding quality. Copper nitride film is selective as the passivation layer in this study due to its unique characteristics. We employed both plasma treatment and magnetron sputtering for fabricating copper nitride films. During the plasma treatment, a passivation layer using the optimal plasma condition is selected, and its excellent electrical performance validates the applicability in low temperature bonding. For the sputtering process, different gas ratios are examined, and the optimal condition aligns well with the observed chip-level bonding quality. The bonding mechanism is thoroughly investigated using TEM and EDX. The results from these two distinct approaches affirm the feasibility of employing copper nitride passivation layer in advanced packaging application.

原文English
主出版物標題Proceedings - IEEE 74th Electronic Components and Technology Conference, ECTC 2024
發行者Institute of Electrical and Electronics Engineers Inc.
頁面2157-2162
頁數6
ISBN(電子)9798350375985
DOIs
出版狀態Published - 2024
事件74th IEEE Electronic Components and Technology Conference, ECTC 2024 - Denver, 美國
持續時間: 28 5月 202431 5月 2024

出版系列

名字Proceedings - Electronic Components and Technology Conference
ISSN(列印)0569-5503

Conference

Conference74th IEEE Electronic Components and Technology Conference, ECTC 2024
國家/地區美國
城市Denver
期間28/05/2431/05/24

指紋

深入研究「Comparison of Different Copper Nitride Passivation Layers Fabrication Methodology and Optimal Growth Condition for Low Temperature Copper-to-Copper Bonding in Advanced Packaging」主題。共同形成了獨特的指紋。

引用此