Compact Modeling of Emerging IC Devices for Technology-Design Co-development

G. Pahwa*, A. Dasgupta, C. T. Tung, M. Y. Kao, C. K. Dabhi, S. Sarker, S. Salahuddin, C. Hu

*此作品的通信作者

研究成果: Conference contribution › 同行評審

3 引文 斯高帕斯（Scopus）

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Keyphrases

Engineering

Computer Science

Material Science