@inproceedings{1eb1c8f31c7549ec835d109e7577080b,
title = "Compact Modeling of Emerging IC Devices for Technology-Design Co-development",
abstract = "This paper presents compact models of GAA, MRAM, ferroelectric logic, and memory devices, as well as cryogenic CMOS that supports quantum computing. These compact models achieve microseconds fast simulation of the charge and current of devices using analytical functions as solutions to complex device physics problems aided by adjustable parameters. Though not as predictive as TCAD, each model can simulate the characteristics and manufacturing variabilities of the device as accurately and much faster. Early availability of compact models of emerging devices is a necessity for technology-design co-development using these devices.",
author = "G. Pahwa and A. Dasgupta and Tung, {C. T.} and Kao, {M. Y.} and Dabhi, {C. K.} and S. Sarker and S. Salahuddin and C. Hu",
note = "Publisher Copyright: {\textcopyright} 2022 IEEE.; 2022 International Electron Devices Meeting, IEDM 2022 ; Conference date: 03-12-2022 Through 07-12-2022",
year = "2022",
doi = "10.1109/IEDM45625.2022.10019433",
language = "English",
series = "Technical Digest - International Electron Devices Meeting, IEDM",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "811--814",
booktitle = "2022 International Electron Devices Meeting, IEDM 2022",
address = "United States",
}