TY - GEN
T1 - Compact 94-GHz 4×4 Butler Matrix Design in IPD Technology
AU - Chiou, Kun Dong
AU - Tseng, Yun Chien
AU - Gao, Donglin
AU - Li, Shuping
AU - Kuo, Chien Nan
AU - Wu, Chung Tse Michael
N1 - Publisher Copyright:
© 2023 IEEE.
PY - 2023
Y1 - 2023
N2 - In this work, we designed 94-GHz 4× 4 Butler matrix circuits in glass-based integrated-passive-device (IPD) technology. Given the design rule constraints, the inevitable crossover structure is carefully planned as a miniature low-pass filter carrying simulated 0.2 dB insertion loss, successfully incorporating parasitics with good matching. The fabricated standard Butler circuit exhibits insertion loss of 8 dB, with mismatch less than 1 dB and phase difference less than 10 degrees at 94 GHz. Size reduced by 34%, the miniaturized circuit shows insertion loss about 1 dB worse but phase mismatch improved by 3 degrees. The core areas of the standard and miniaturized circuits are 1.42× 1.22 mm2 and 1.04× 1.08 mm2, respectively. The designs are applicable to beamforming phased arrays in the W band.
AB - In this work, we designed 94-GHz 4× 4 Butler matrix circuits in glass-based integrated-passive-device (IPD) technology. Given the design rule constraints, the inevitable crossover structure is carefully planned as a miniature low-pass filter carrying simulated 0.2 dB insertion loss, successfully incorporating parasitics with good matching. The fabricated standard Butler circuit exhibits insertion loss of 8 dB, with mismatch less than 1 dB and phase difference less than 10 degrees at 94 GHz. Size reduced by 34%, the miniaturized circuit shows insertion loss about 1 dB worse but phase mismatch improved by 3 degrees. The core areas of the standard and miniaturized circuits are 1.42× 1.22 mm2 and 1.04× 1.08 mm2, respectively. The designs are applicable to beamforming phased arrays in the W band.
UR - http://www.scopus.com/inward/record.url?scp=85186714099&partnerID=8YFLogxK
U2 - 10.1109/APMC57107.2023.10439865
DO - 10.1109/APMC57107.2023.10439865
M3 - Conference contribution
AN - SCOPUS:85186714099
T3 - Asia-Pacific Microwave Conference Proceedings, APMC
SP - 814
EP - 816
BT - 2023 Asia-Pacific Microwave Conference, APMC 2023
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 31st Asia-Pacific Microwave Conference, APMC 2023
Y2 - 5 December 2023 through 8 December 2023
ER -