CMP of ultra low-k material porous-polysilazane (PPSZ) for interconnect applications

T. C. Chang*, T. M. Tsai, Po-Tsun Liu, C. W. Chen, S. T. Yan, H. Aoki, Y. C. Chang, Tseung-Yuen Tseng

*此作品的通信作者

研究成果同行評審

15 引文 斯高帕斯(Scopus)

指紋

深入研究「CMP of ultra low-k material porous-polysilazane (PPSZ) for interconnect applications」主題。共同形成了獨特的指紋。

Keyphrases

Material Science

Chemical Engineering