CMP of low-k methylsilsesquiazane with oxygen plasma treatment for multilevel interconnect applications

T. C. Chang*, T. M. Tsai, Po-Tsun Liu, C. W. Chen, S. T. Yan, H. Aoki, Y. C. Chang, Tseung-Yuen Tseng

*此作品的通信作者

研究成果: Article › 同行評審

11 引文 斯高帕斯（Scopus）

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Keyphrases

Engineering

Material Science