Chiplet Placement for 2.5D IC with Sequence Pair Based Tree and Thermal Consideration
- Hong Wen Chiou
- , Jia Hao Jiang
- , Yu Teng Chang
- , Yu Min Lee
- , Chi Wen Pan
研究成果: Conference contribution › 同行評審
13
引文
斯高帕斯（Scopus）