@inproceedings{5f9a0e14ae0e4cee92d5c46ca671c7e6,
title = "Chip-level and board-level CDM ESD tests on IC products",
abstract = "The electrostatic discharge (ESD) transient currents and failure analysis (FA) between chip-level and board-level charged-device-model (CDM) ESD tests are investigated in this work. The discharging current waveforms of three different printed circuit boards (PCBs) are characterized first. Then, the chip-level and board-level CDM ESD tests are performed to an ESD-protected dummy NMOS and a high-speed receiver front-end circuit, respectively. Scanning electron microscope (SEM) failure pictures show that the board-level CDM ESD test causes much severer failure than that caused by the chip-level CDM ESD test.",
author = "Ming-Dou Ker and Huang, {Chih Kuo} and Hsiao, {Yuan Wen} and Hsieh, {Yong Fen}",
year = "2009",
month = nov,
day = "16",
doi = "10.1109/IPFA.2009.5232702",
language = "English",
isbn = "9781424439102",
series = "Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA",
pages = "45--49",
booktitle = "Proceedings of the 2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2009",
note = "2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2009 ; Conference date: 06-07-2009 Through 10-07-2009",
}