Characteristics of low-k methyl-silsesquiazane (MSZ) for CMP process using oxygen plasma pretreatment

Keyphrases

• CMP Process 100%
• Methyl 100%
• Silsesquiazane 100%
• Oxygen Plasma Pre-treatment 100%
• O2 Plasma Treatment 50%
• Post-CMP 25%
• Plasma Treatment 25%
• Wafer 12%
• Dielectric 12%
• Electrical Properties 12%
• Low Dielectric Constant 12%
• Electrical Analysis 12%
• Oxygen Effect 12%
• Material Analysis 12%
• Spinon 12%
• Film Stills 12%
• Modification Surface 12%
• Low-κ 12%
• Glass Process 12%

Engineering

• Plasma Treatment 100%
• Pretreatment 100%
• Dielectrics 50%
• Experimental Result 25%
• Polish Rate 25%

Material Science

• Film 100%
• Surface Treatment 50%
• Permittivity 50%
• Dielectric Material 50%