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Characteristics of flexible and transparent Eu
2
O
3
resistive switching memory at high bending condition
R. Aluguri, R. Sailesh, D. Kumar, Tseung-Yuen Tseng
電子研究所
研究成果
:
Article
›
同行評審
17
引文 斯高帕斯(Scopus)
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2
O
3
resistive switching memory at high bending condition」主題。共同形成了獨特的指紋。
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Keyphrases
Bending Condition
100%
Resistive Random Access Memory (ReRAM)
100%
Resistive Switching
100%
Eu2O3
100%
Electrical Characteristics
50%
Bottom Electrode
50%
Freeform
50%
Dielectric Layer
50%
Memory Window
50%
Memory Device
50%
Oxide Layer
50%
Low Resistance State
50%
High Resistance State
50%
Conduction Mechanism
50%
Interlayer Resistance
50%
Flexible Devices
50%
Aluminum-doped Zinc Oxide
50%
Flexible Memory
50%
Ohmic Conduction
50%
ITO-PET
50%
Device Area
50%
Bending Radius
50%
Poole-Frenkel Mechanism
50%
Transparent Memory
50%
Material Science
Indium Tin Oxide
100%
Dielectric Material
50%
Electrical Property
50%
Zinc Oxide
50%
Aluminum
50%
Engineering
Resistive
100%
Dielectric Layer
25%
Oxide Layer
25%
High Resistance State
25%
Aluminium-Doped Zinc Oxide
25%
Ohmic Conduction
25%
Bending Radius
25%