@inproceedings{cffdc7deadab42439a662d6b6e8cb550,
title = "Carbon/Nitrogen Dual-Doped in <100> P-Type Silicon Hard Mask for Wafer Thinning and Dishing Less for Hybrid Bonding",
abstract = "Wafer thinning technology can provide high-density interconnections for integrated circuits, reduce power loss, and fulfill the demand for thin and miniaturized packaging of devices, thus realizing the goal of comprehensively improving the performance of semiconductor devices. Higher density chip connectivity through dual ion selective higher etch Ratio, lower on-resistance and ultra-thin die packages.",
keywords = "Carbon dope, CMP, Hybrid bonding, Nitrogen dope, Wafer-thinning",
author = "Chen, {Yen Shuo} and Chiu, {Tzu Wei} and Fan, {Hua Tai} and Ko, {Yu Chien} and Chen, {Chu Chi} and Ko, {Fu Hsiang}",
note = "Publisher Copyright: {\textcopyright} 2024 Japan Institute of Electronics Packaging.; 23rd International Conference on Electronics Packaging, ICEP 2024 ; Conference date: 17-04-2024 Through 20-04-2024",
year = "2024",
doi = "10.23919/ICEP61562.2024.10535686",
language = "English",
series = "2024 International Conference on Electronics Packaging, ICEP 2024",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "75--76",
booktitle = "2024 International Conference on Electronics Packaging, ICEP 2024",
address = "United States",
}