摘要
Capacitor-couple technique used to lower snapback-trigger voltage and to ensure uniform ESD current distribution in deep-submicron CMOS on-chip ESD protection circuit is proposed. The coupling capacitor is realized by a poly layer right under the wire-bonding metal pad without increasing extra layout area to the pad. A timing-original design model has been derived to calculate the capacitor-couple efficiency of this proposed ESD protection circuit. Using this capacitor-couple ESD protection circuit, the thinner gate oxide of CMOS devices in deep-submicron low-voltage CMOS ASIC can be effectively protected.
原文 | English |
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頁(從 - 到) | 307-321 |
頁數 | 15 |
期刊 | IEEE Transactions on Very Large Scale Integration (VLSI) Systems |
卷 | 4 |
發行號 | 3 |
DOIs | |
出版狀態 | Published - 1996 |