摘要
The sputtering rate during a plasma-assisted process was calculated. Monte Carlo simulation was used for the calculation. It was observed that sputtering was one of the most important mechanisms occurring on the cathod during a plasma-assisted process.
原文 | English |
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頁(從 - 到) | 1125-1126 |
頁數 | 2 |
期刊 | Journal of Materials Science Letters |
卷 | 22 |
發行號 | 16 |
DOIs | |
出版狀態 | Published - 15 8月 2003 |