Built-in self-test/repair methodology for multiband RF-Interconnected TSV 3D integration

Shu Feng Cheng; Po Tsang Huang; Li Chun Wang; Mau Chung Frank Chang

doi:10.1109/MDAT.2019.2932935

Built-in self-test/repair methodology for multiband RF-Interconnected TSV 3D integration

Shu Feng Cheng
, Po Tsang Huang
, Li Chun Wang^*
, Mau Chung Frank Chang

^*此作品的通信作者

研究成果: Article › 同行評審

4 引文斯高帕斯（Scopus）

摘要

Editor's note: Multiband radio-frequency interconnect (MRFI) is an emerging technology to achieve low-latency and energy-efficient on-chip communication. This article proposes a BIST method to improve the reliability of MRFI-based design. -Partha Pratim Pande, Washington State University.

原文	English
文章編號	8786260
頁（從 - 到）	63-71
頁數	9
期刊	IEEE Design and Test
卷	36
發行號	6
DOIs	https://doi.org/10.1109/MDAT.2019.2932935
出版狀態	Published - 12月 2019

存取文件

10.1109/MDAT.2019.2932935

其它文件與鏈接

Link to publication in Scopus

引用此

@article{63338d0a2226456c9155aa82bbe323fc,

title = "Built-in self-test/repair methodology for multiband RF-Interconnected TSV 3D integration",

abstract = "Editor's note: Multiband radio-frequency interconnect (MRFI) is an emerging technology to achieve low-latency and energy-efficient on-chip communication. This article proposes a BIST method to improve the reliability of MRFI-based design. -Partha Pratim Pande, Washington State University.",

keywords = "BIST/R, e-fuse, multiband RF-Interconnect, phase error, PRBS, test methodology, TSV density, yield improvement",

author = "Cheng, \{Shu Feng\} and Huang, \{Po Tsang\} and Wang, \{Li Chun\} and Chang, \{Mau Chung Frank\}",

year = "2019",

month = dec,

doi = "10.1109/MDAT.2019.2932935",

language = "English",

volume = "36",

pages = "63--71",

journal = "IEEE Design and Test",

issn = "2168-2356",

publisher = "IEEE Computer Society",

number = "6",

}

TY - JOUR

T1 - Built-in self-test/repair methodology for multiband RF-Interconnected TSV 3D integration

AU - Cheng, Shu Feng

AU - Huang, Po Tsang

AU - Wang, Li Chun

AU - Chang, Mau Chung Frank

PY - 2019/12

Y1 - 2019/12

N2 - Editor's note: Multiband radio-frequency interconnect (MRFI) is an emerging technology to achieve low-latency and energy-efficient on-chip communication. This article proposes a BIST method to improve the reliability of MRFI-based design. -Partha Pratim Pande, Washington State University.

AB - Editor's note: Multiband radio-frequency interconnect (MRFI) is an emerging technology to achieve low-latency and energy-efficient on-chip communication. This article proposes a BIST method to improve the reliability of MRFI-based design. -Partha Pratim Pande, Washington State University.

KW - BIST/R

KW - e-fuse

KW - multiband RF-Interconnect

KW - phase error

KW - PRBS

KW - test methodology

KW - TSV density

KW - yield improvement

UR - https://www.scopus.com/pages/publications/85074670382

U2 - 10.1109/MDAT.2019.2932935

DO - 10.1109/MDAT.2019.2932935

M3 - Article

AN - SCOPUS:85074670382

SN - 2168-2356

VL - 36

SP - 63

EP - 71

JO - IEEE Design and Test

JF - IEEE Design and Test

IS - 6

M1 - 8786260

ER -

Built-in self-test/repair methodology for multiband RF-Interconnected TSV 3D integration

摘要

存取文件

其它文件與鏈接

指紋

引用此