@article{63338d0a2226456c9155aa82bbe323fc,
title = "Built-in self-test/repair methodology for multiband RF-Interconnected TSV 3D integration",
abstract = "Editor's note: Multiband radio-frequency interconnect (MRFI) is an emerging technology to achieve low-latency and energy-efficient on-chip communication. This article proposes a BIST method to improve the reliability of MRFI-based design. -Partha Pratim Pande, Washington State University.",
keywords = "BIST/R, e-fuse, multiband RF-Interconnect, phase error, PRBS, test methodology, TSV density, yield improvement",
author = "Cheng, {Shu Feng} and Huang, {Po Tsang} and Wang, {Li Chun} and Chang, {Mau Chung Frank}",
year = "2019",
month = dec,
doi = "10.1109/MDAT.2019.2932935",
language = "English",
volume = "36",
pages = "63--71",
journal = "IEEE Design and Test",
issn = "2168-2356",
publisher = "IEEE Computer Society",
number = "6",
}