@inproceedings{1c658f52116f4a87a47f50b204579f8d,
title = "Bonding temperature effect on the performance of flip chip assembled 150nm mHEMT device on organic substrate",
abstract = "Due to the rapid growth of wireless communication systems, high frequency packages become very important and they require compactness, low cost and high performances even at frequency up to 60 GHz. Flip-chip assembly using organic substrate at very high frequency has become a cost competitive packaging method in semiconductor industries.",
author = "Kuo, {Chien I.} and Lim, {Wee Chin} and Heng-Tung Hsu and Wang, {Chin Te} and Hsu, {Li Han} and Faiz Aizad and Hung, {Guo Wei} and Yasuyuki Miyamoto and Chang, {Edward Yi}",
year = "2010",
doi = "10.1109/ESCINANO.2010.5700949",
language = "English",
isbn = "9781424488544",
series = "2010 International Conference on Enabling Science and Nanotechnology, ESciNano 2010 - Proceedings",
booktitle = "2010 International Conference on Enabling Science and Nanotechnology, ESciNano 2010 - Proceedings",
note = "2010 International Conference on Enabling Science and Nanotechnology, ESciNano 2010 ; Conference date: 01-12-2010 Through 03-12-2010",
}