Bonding temperature effect on the performance of flip chip assembled 150nm mHEMT device on organic substrate

Chien I. Kuo, Wee Chin Lim, Heng-Tung Hsu, Chin Te Wang, Li Han Hsu, Faiz Aizad, Guo Wei Hung, Yasuyuki Miyamoto, Edward Yi Chang

研究成果: Conference contribution同行評審

1 引文 斯高帕斯(Scopus)

摘要

Due to the rapid growth of wireless communication systems, high frequency packages become very important and they require compactness, low cost and high performances even at frequency up to 60 GHz. Flip-chip assembly using organic substrate at very high frequency has become a cost competitive packaging method in semiconductor industries.

原文English
主出版物標題2010 International Conference on Enabling Science and Nanotechnology, ESciNano 2010 - Proceedings
DOIs
出版狀態Published - 2010
事件2010 International Conference on Enabling Science and Nanotechnology, ESciNano 2010 - Kuala Lumpur, Malaysia
持續時間: 1 12月 20103 12月 2010

出版系列

名字2010 International Conference on Enabling Science and Nanotechnology, ESciNano 2010 - Proceedings

Conference

Conference2010 International Conference on Enabling Science and Nanotechnology, ESciNano 2010
國家/地區Malaysia
城市Kuala Lumpur
期間1/12/103/12/10

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