Body-tied germanium FinFETs directly on a silicon substrate

We fabricated body-tied Ge p-channel fin fieldeffect transistors (p-FinFETs) directly on a Si substrate with a high-?/metal gate stack. This scheme is fully compatible with Si standard processing. The FinFET structure has excellent control on the channel potential and thus can improve the short-channel effect. The diode with p?Si heterojunctions illustrates a remarkably high I_ON/I_OFF > 10⁶ despite the presence of misfit dislocations at the interface. The high-hole-mobility body-tied Ge p-FinFETs with a fin widthWFin of ∼40 nm and a mask channel length LMask of 120 nm depict a driving current of 22 μA/μm at _G = ?2 V and a low OFF-current of 3 nA/μm at V_G = 2 V. The subthreshold characteristics with a swing of 228 mV/dec and drain-induced barrier lowering of 288 mV/V are demonstrated..