摘要
In this letter, we have successfully fabricated a metal-ferroelectricity-metal (MFM) capacitor of an ultrathin 5 nm HZO utilizing Molybdenum (Mo) as the electrodes. By proposing a novel atomic layer deposition (ALD) scheme, we overcome the challenge of oxidation of the lower Mo electrode; a 2 nm HZO deposited by thermally enhanced ALD followed by a 3 nm HZO deposited by plasma enhanced ALD. The fabricated sample demonstrated a 2Pr value of 38.5 μC/cm2 at an operating voltage of 2 V. Furthermore, in endurance testing, the sample maintained a 2Pr value of 36.9 μC/cm2 even after 1010 cycles (Δ2Pr/2Prpristine ≈ 7% from pristine to 1010 cycles). With a maximum process temperature of 400 °C, our approach thereby meets the stringent requirement of Back-End-of-Line (BEOL) integration.
原文 | English |
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頁(從 - 到) | 474-477 |
頁數 | 4 |
期刊 | IEEE Transactions on Nanotechnology |
卷 | 23 |
DOIs | |
出版狀態 | Published - 2024 |