Avalanche Photodiode with Multiple Multiplication-Layers and Flip-Chip Bonding Package for 4-D FMCW LiDAR Applications

Yan Chieh Chang; Yu Xiang Lin; Zohauddin Ahmad; Chia Chien Wei; You Chia Chang; Jin Wei Shi

doi:10.1109/IPC57732.2023.10360573

Avalanche Photodiode with Multiple Multiplication-Layers and Flip-Chip Bonding Package for 4-D FMCW LiDAR Applications

Yan Chieh Chang, Yu Xiang Lin, Zohauddin Ahmad, Chia Chien Wei, You Chia Chang, Jin Wei Shi^*

^*此作品的通信作者

光電工程學系

研究成果: Conference contribution › 同行評審

摘要

APDs with multiple multiplication-layers and flip-chip bonding package is demonstrated. It exhibits wide 3-dB bandwidths (4.8GHz), high responsivity (10.7A/W), and high saturation current (>4.3mA) at 0.9V_br. Using this device, we obtain superior quality of 4-D images to that of p-i-n PD in FWCW LiDAR system.

原文	English
主出版物標題	2023 IEEE Photonics Conference, IPC 2023 - Proceedings
發行者	Institute of Electrical and Electronics Engineers Inc.
ISBN（電子）	9798350347227
DOIs	https://doi.org/10.1109/IPC57732.2023.10360573
出版狀態	Published - 2023
事件	2023 IEEE Photonics Conference, IPC 2023 - Orlando, United States 持續時間: 12 11月 2023 → 16 11月 2023

出版系列

名字	2023 IEEE Photonics Conference, IPC 2023 - Proceedings

Conference

Conference	2023 IEEE Photonics Conference, IPC 2023
國家/地區	United States
城市	Orlando
期間	12/11/23 → 16/11/23

存取文件

10.1109/IPC57732.2023.10360573

其它文件與鏈接

Link to publication in Scopus

引用此

Chang, Y. C., Lin, Y. X., Ahmad, Z., Wei, C. C., Chang, Y. C., & Shi, J. W. (2023). Avalanche Photodiode with Multiple Multiplication-Layers and Flip-Chip Bonding Package for 4-D FMCW LiDAR Applications. 於 2023 IEEE Photonics Conference, IPC 2023 - Proceedings (2023 IEEE Photonics Conference, IPC 2023 - Proceedings). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/IPC57732.2023.10360573

@inproceedings{11c2978ec1404031ac8c2325f481a79a,

title = "Avalanche Photodiode with Multiple Multiplication-Layers and Flip-Chip Bonding Package for 4-D FMCW LiDAR Applications",

abstract = "APDs with multiple multiplication-layers and flip-chip bonding package is demonstrated. It exhibits wide 3-dB bandwidths (4.8GHz), high responsivity (10.7A/W), and high saturation current (>4.3mA) at 0.9Vbr. Using this device, we obtain superior quality of 4-D images to that of p-i-n PD in FWCW LiDAR system.",

keywords = "Avalanche photodiodes, FMCW Lidar",

author = "Chang, {Yan Chieh} and Lin, {Yu Xiang} and Zohauddin Ahmad and Wei, {Chia Chien} and Chang, {You Chia} and Shi, {Jin Wei}",

note = "Publisher Copyright: {\textcopyright} 2023 IEEE.; 2023 IEEE Photonics Conference, IPC 2023 ; Conference date: 12-11-2023 Through 16-11-2023",

year = "2023",

doi = "10.1109/IPC57732.2023.10360573",

language = "English",

series = "2023 IEEE Photonics Conference, IPC 2023 - Proceedings",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

booktitle = "2023 IEEE Photonics Conference, IPC 2023 - Proceedings",

address = "United States",

}

Chang, YC, Lin, YX, Ahmad, Z, Wei, CC, Chang, YC & Shi, JW 2023, Avalanche Photodiode with Multiple Multiplication-Layers and Flip-Chip Bonding Package for 4-D FMCW LiDAR Applications. 於 2023 IEEE Photonics Conference, IPC 2023 - Proceedings. 2023 IEEE Photonics Conference, IPC 2023 - Proceedings, Institute of Electrical and Electronics Engineers Inc., 2023 IEEE Photonics Conference, IPC 2023, Orlando, United States, 12/11/23. https://doi.org/10.1109/IPC57732.2023.10360573

Avalanche Photodiode with Multiple Multiplication-Layers and Flip-Chip Bonding Package for 4-D FMCW LiDAR Applications. / Chang, Yan Chieh; Lin, Yu Xiang; Ahmad, Zohauddin 等.
2023 IEEE Photonics Conference, IPC 2023 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 2023. (2023 IEEE Photonics Conference, IPC 2023 - Proceedings).

研究成果: Conference contribution › 同行評審

TY - GEN

T1 - Avalanche Photodiode with Multiple Multiplication-Layers and Flip-Chip Bonding Package for 4-D FMCW LiDAR Applications

AU - Chang, Yan Chieh

AU - Lin, Yu Xiang

AU - Ahmad, Zohauddin

AU - Wei, Chia Chien

AU - Chang, You Chia

AU - Shi, Jin Wei

PY - 2023

Y1 - 2023

N2 - APDs with multiple multiplication-layers and flip-chip bonding package is demonstrated. It exhibits wide 3-dB bandwidths (4.8GHz), high responsivity (10.7A/W), and high saturation current (>4.3mA) at 0.9Vbr. Using this device, we obtain superior quality of 4-D images to that of p-i-n PD in FWCW LiDAR system.

AB - APDs with multiple multiplication-layers and flip-chip bonding package is demonstrated. It exhibits wide 3-dB bandwidths (4.8GHz), high responsivity (10.7A/W), and high saturation current (>4.3mA) at 0.9Vbr. Using this device, we obtain superior quality of 4-D images to that of p-i-n PD in FWCW LiDAR system.

KW - Avalanche photodiodes

KW - FMCW Lidar

UR - http://www.scopus.com/inward/record.url?scp=85182550009&partnerID=8YFLogxK

U2 - 10.1109/IPC57732.2023.10360573

DO - 10.1109/IPC57732.2023.10360573

M3 - Conference contribution

AN - SCOPUS:85182550009

T3 - 2023 IEEE Photonics Conference, IPC 2023 - Proceedings

BT - 2023 IEEE Photonics Conference, IPC 2023 - Proceedings

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 2023 IEEE Photonics Conference, IPC 2023

Y2 - 12 November 2023 through 16 November 2023

ER -

Chang YC, Lin YX, Ahmad Z, Wei CC, Chang YC, Shi JW. Avalanche Photodiode with Multiple Multiplication-Layers and Flip-Chip Bonding Package for 4-D FMCW LiDAR Applications. 於 2023 IEEE Photonics Conference, IPC 2023 - Proceedings. Institute of Electrical and Electronics Engineers Inc. 2023. (2023 IEEE Photonics Conference, IPC 2023 - Proceedings). doi: 10.1109/IPC57732.2023.10360573

Avalanche Photodiode with Multiple Multiplication-Layers and Flip-Chip Bonding Package for 4-D FMCW LiDAR Applications

摘要

出版系列

Conference

存取文件

其它文件與鏈接

指紋

引用此