Automatic device model parameter extractions via hybrid intelligent methodology

Cheng Che Liu, Yiming Li*, Ya Shu Yang, Chieh Yang Chen, Min Hui Chuang

*此作品的通信作者

研究成果: Conference contribution同行評審

摘要

We report an advanced hybrid intelligent methodology for device model parameter extractions combining multiobjective evolutionary algorithms, numerical optimization methods, and unsupervised learning neural networks on a unified optimization framework. The results between experimentally measured data and the calculation from industrial standard compact models are accurate, stable and convergent rapidly for all I-V curves. Verifications from diodes, bipolar transistors, MOSFETs, FinFETs, to nanowire MOSFETs confirm the robustness of the developed prototype, where the extraction is within 5% of accuracy.

原文English
主出版物標題2020 International Conference on Simulation of Semiconductor Processes and Devices, SISPAD 2020
發行者Institute of Electrical and Electronics Engineers Inc.
頁面355-358
頁數4
ISBN(電子)9784863487635
DOIs
出版狀態Published - 23 九月 2020
事件2020 International Conference on Simulation of Semiconductor Processes and Devices, SISPAD 2020 - Virtual, Kobe, Japan
持續時間: 3 九月 20206 十月 2020

出版系列

名字International Conference on Simulation of Semiconductor Processes and Devices, SISPAD
2020-September

Conference

Conference2020 International Conference on Simulation of Semiconductor Processes and Devices, SISPAD 2020
國家/地區Japan
城市Virtual, Kobe
期間3/09/206/10/20

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