Au-Free GaN High-Electron-Mobility Transistor with Ti/Al/W Ohmic and WNX Schottky Metal Structures for High-Power Applications

Ting En Hsieh, Yueh Chin Lin, Chung Ming Chu, Yu Lin Chuang, Yu Xiang Huang, Wang Cheng Shi, Chang Fu Dee, Burhanuddin Yeop Majlis, Wei-I Lee, Edward Yi Chang*

*此作品的通信作者

研究成果: Article同行評審

4 引文 斯高帕斯(Scopus)

摘要

In this study, an Au-free AlGaN/GaN high-electron-mobility transistor (HEMT) with Ti/Al/W ohmic and WNx Schottky metal structures is fabricated and characterized. The device exhibits smooth surface morphology after metallization and shows excellent direct-current (DC) characteristics. The device also demonstrates better performance than the conventional HEMTs under high voltage stress. Furthermore, the Au-free AlGaN/GaN HEMT shows stable device performance after annealing at 400°C. Thus, the Ti/Al/W ohmic and WNX Schottky metals can be applied in the manufacturing of GaN HEMT to replace the Au based contacts to reduce the manufacturing costs of the GaN HEMT devices with comparable device performance.

原文English
頁(從 - 到)3285-3289
頁數5
期刊Journal of Electronic Materials
45
發行號7
DOIs
出版狀態Published - 1 7月 2016

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