TY - GEN
T1 - Asymmetric low temperature cu-polymer hybrid bonding with Au passivation layer
AU - Weng, Ming Wei
AU - Mao, Shan Yu
AU - Liu, Demin
AU - Hu, Han Wen
AU - Chen, Kuan Neng
N1 - Publisher Copyright:
© 2021 IEEE.
PY - 2021/4/19
Y1 - 2021/4/19
N2 - In this study, an asymmetric Cu-polymer hybrid bonding technology was successfully developed at 200 °C, which uses SU-8 for polymer bonding and Au passivation for Cu bonding. The polymer bonding performance was investigated by the analyses of sat, SEM and pulling test, indicating that bonding with the best quality was achieved at 200 °C. With the Au passivation layer capping on the Cu surface, a low temperature Cu-Cu bonding process can be realized at 200 °C. After demonstrating the bonding process with single material, a chip-level hybrid bonding structure was fabricated and bonded successfully. The hybrid bonding interface was observed by the SEM images, showing that both of the metal and polymer region were well bonded. Furthermore, the electrical properties and reliability performance were analyzed by electrical measurements with a modified Kelvin structure and after un-biased highly accelerated stress test for 168 hours. The bonded structure can still maintain excellent electrical property about 10-7 Ω•cm2. Based on the bonding results, this research provides a practical concept for low temperature hybrid bonding in 3D integration.
AB - In this study, an asymmetric Cu-polymer hybrid bonding technology was successfully developed at 200 °C, which uses SU-8 for polymer bonding and Au passivation for Cu bonding. The polymer bonding performance was investigated by the analyses of sat, SEM and pulling test, indicating that bonding with the best quality was achieved at 200 °C. With the Au passivation layer capping on the Cu surface, a low temperature Cu-Cu bonding process can be realized at 200 °C. After demonstrating the bonding process with single material, a chip-level hybrid bonding structure was fabricated and bonded successfully. The hybrid bonding interface was observed by the SEM images, showing that both of the metal and polymer region were well bonded. Furthermore, the electrical properties and reliability performance were analyzed by electrical measurements with a modified Kelvin structure and after un-biased highly accelerated stress test for 168 hours. The bonded structure can still maintain excellent electrical property about 10-7 Ω•cm2. Based on the bonding results, this research provides a practical concept for low temperature hybrid bonding in 3D integration.
UR - http://www.scopus.com/inward/record.url?scp=85108144347&partnerID=8YFLogxK
U2 - 10.1109/VLSI-TSA51926.2021.9440101
DO - 10.1109/VLSI-TSA51926.2021.9440101
M3 - Conference contribution
AN - SCOPUS:85108144347
T3 - VLSI-TSA 2021 - 2021 International Symposium on VLSI Technology, Systems and Applications, Proceedings
BT - VLSI-TSA 2021 - 2021 International Symposium on VLSI Technology, Systems and Applications, Proceedings
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2021 International Symposium on VLSI Technology, Systems and Applications, VLSI-TSA 2021
Y2 - 19 April 2021 through 22 April 2021
ER -