Asymmetric Low Temperature Bonding Structure with Thin Solder Layers Using Ultra-Thin Buffer Layer

Keyphrases

• Ultrathin 100%
• Bonding Structure 100%
• Buffer Layer 100%
• Thin Buffer 100%
• Solder Layer 100%
• Low-temperature Bonding 100%
• Intermetallic Compound Formation 66%
• Asymmetric Structure 66%
• Low Temperature 33%
• Bonding Technology 33%
• Submicron 33%
• High Density 33%
• Soldering 33%
• Electrical Isolation 33%
• Hybrid Bonding 33%
• Three-dimensional Integration 33%
• Isolation Method 33%
• Solder Process 33%
• Polymer Curing 33%

Material Science

• Buffer Layer 100%
• Intermetallics 66%
• Density 33%