Assembly of micro-3-D components on SOI wafers using novel SU-8 locking mechanisms and vertical one-push operation

Yi Chiu; Chang Shiou Wu; Wei Zhi Huang; Jhong Wei Wu

doi:10.1109/JSTQE.2009.2018478

Assembly of micro-3-D components on SOI wafers using novel SU-8 locking mechanisms and vertical one-push operation

Yi Chiu^*, Chang Shiou Wu, Wei Zhi Huang, Jhong Wei Wu

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電機工程學系

研究成果: Article › 同行評審

6 引文斯高帕斯（Scopus）

摘要

A novel out-of-plane assembly technique of 3-D microstructures is proposed and demonstrated by using simple vertical one-push operations. This one-push method has large probe positioning tolerance in both vertical and lateral directions to reduce the overall complexity of the assembly process. Micromirrors and corner cube reflectors are fabricated on silicon-on-insulator wafers using SU-8 photoresist as a second structure layer in a low-temperature process. Batch assembly of multiple mirrors assembled simultaneously is demonstrated.

原文	English
文章編號	4982735
頁（從 - 到）	1338-1343
頁數	6
期刊	IEEE Journal on Selected Topics in Quantum Electronics
卷	15
發行號	5
DOIs	https://doi.org/10.1109/JSTQE.2009.2018478
出版狀態	Published - 1 9月 2009

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10.1109/JSTQE.2009.2018478

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abstract = "A novel out-of-plane assembly technique of 3-D microstructures is proposed and demonstrated by using simple vertical one-push operations. This one-push method has large probe positioning tolerance in both vertical and lateral directions to reduce the overall complexity of the assembly process. Micromirrors and corner cube reflectors are fabricated on silicon-on-insulator wafers using SU-8 photoresist as a second structure layer in a low-temperature process. Batch assembly of multiple mirrors assembled simultaneously is demonstrated.",

keywords = "Assembly, Hinge, Microelectromechanical system (MEMS), One push, Out of plane",

author = "Yi Chiu and Wu, {Chang Shiou} and Huang, {Wei Zhi} and Wu, {Jhong Wei}",

year = "2009",

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doi = "10.1109/JSTQE.2009.2018478",

language = "English",

volume = "15",

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journal = "IEEE Journal on Selected Topics in Quantum Electronics",

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T1 - Assembly of micro-3-D components on SOI wafers using novel SU-8 locking mechanisms and vertical one-push operation

AU - Chiu, Yi

AU - Wu, Chang Shiou

AU - Huang, Wei Zhi

AU - Wu, Jhong Wei

PY - 2009/9/1

Y1 - 2009/9/1

N2 - A novel out-of-plane assembly technique of 3-D microstructures is proposed and demonstrated by using simple vertical one-push operations. This one-push method has large probe positioning tolerance in both vertical and lateral directions to reduce the overall complexity of the assembly process. Micromirrors and corner cube reflectors are fabricated on silicon-on-insulator wafers using SU-8 photoresist as a second structure layer in a low-temperature process. Batch assembly of multiple mirrors assembled simultaneously is demonstrated.

AB - A novel out-of-plane assembly technique of 3-D microstructures is proposed and demonstrated by using simple vertical one-push operations. This one-push method has large probe positioning tolerance in both vertical and lateral directions to reduce the overall complexity of the assembly process. Micromirrors and corner cube reflectors are fabricated on silicon-on-insulator wafers using SU-8 photoresist as a second structure layer in a low-temperature process. Batch assembly of multiple mirrors assembled simultaneously is demonstrated.

KW - Assembly

KW - Hinge

KW - Microelectromechanical system (MEMS)

KW - One push

KW - Out of plane

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U2 - 10.1109/JSTQE.2009.2018478

DO - 10.1109/JSTQE.2009.2018478

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AN - SCOPUS:70350158590

SN - 1077-260X

VL - 15

SP - 1338

EP - 1343

JO - IEEE Journal on Selected Topics in Quantum Electronics

JF - IEEE Journal on Selected Topics in Quantum Electronics

IS - 5

M1 - 4982735

ER -

Assembly of micro-3-D components on SOI wafers using novel SU-8 locking mechanisms and vertical one-push operation

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