Application of Elevated-Laser-Liquid-Phase-Epitaxy (ELLPE) Technique on Different Oriented Wafers for Monolithic 3DIC Integration

Bo Jheng Shih*, Yu Ming Pan, Chiao Yen Wang, Huan Yu Chiu, Chih Chao Yang, Chang Hong Shen, Huang Chung Cheng, Kuan Neng Chen

*此作品的通信作者

研究成果: Conference contribution同行評審

1 引文 斯高帕斯(Scopus)

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Keyphrases

Material Science

Engineering