Application of Elevated-Laser-Liquid-Phase-Epitaxy (ELLPE) Technique on Different Oriented Wafers for Monolithic 3DIC Integration

Bo Jheng Shih*, Yu Ming Pan, Chiao Yen Wang, Huan Yu Chiu, Chih Chao Yang, Chang Hong Shen, Huang Chung Cheng, Kuan Neng Chen

*此作品的通信作者

研究成果: Conference contribution同行評審

摘要

This study presents an innovative Elevated-Laser-Liquid-Phase-Epitaxy (ELLPE) technique for producing single-crystal channels in upper-layer circuits. By employing a green nanosecond laser process, the overall process temperature remains within the low thermal budget of monolithic 3DIC, enabling the transformation of amorphous silicon thin films into high-quality continuous films with uniform crystal orientation. Furthermore, we confirmed the successful fabrication of high-quality single-crystal continuous films, aligning with the crystallographic orientation of wafers across various lattice directions through EBSD analysis, and their single-crystalline nature were verified through TEM analysis. These research findings effectively overcome the historical limitation of sequential integration, which was restricted to generating polycrystalline channels exclusively in upper-layer circuits, thus opening avenues for numerous future applications.

原文English
主出版物標題Proceedings - IEEE 74th Electronic Components and Technology Conference, ECTC 2024
發行者Institute of Electrical and Electronics Engineers Inc.
頁面2167-2171
頁數5
ISBN(電子)9798350375985
DOIs
出版狀態Published - 2024
事件74th IEEE Electronic Components and Technology Conference, ECTC 2024 - Denver, 美國
持續時間: 28 5月 202431 5月 2024

出版系列

名字Proceedings - Electronic Components and Technology Conference
ISSN(列印)0569-5503

Conference

Conference74th IEEE Electronic Components and Technology Conference, ECTC 2024
國家/地區美國
城市Denver
期間28/05/2431/05/24

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