摘要
We propose a novel process whereby Antimony Assisted Arsenic Source/Drain Extension (A3 SDE) is employed to realize a steep and retrograde indium pocket profile for sub-0.1μm nMOSFETs. By engineering the defect distributions in the amorphous layer created by indium implant, this new process improves 8% current drive while maintaining the same Ioff. It reduces nMOS diode leakage by two orders of magnitude and sidewall junction capacitance near the gate by 14%. Reliability assessment of devices fabricated by the A3 SDE process reveals significant improvement in hot carrier effects and no observable degradation of gate oxide integrity.
原文 | English |
---|---|
頁(從 - 到) | 63-66 |
頁數 | 4 |
期刊 | Technical Digest - International Electron Devices Meeting |
DOIs | |
出版狀態 | Published - 2001 |
事件 | IEEE International Electron Devices Meeting IEDM 2001 - Washington, DC, 美國 持續時間: 2 12月 2001 → 5 12月 2001 |