Antibacterial properties of TaN-(Ag,Cu) nanocomposite thin films

J. H. Hsieh*, T. H. Yeh, C. Li, C. H. Chiu, C. T. Huang

*此作品的通信作者

研究成果: Article同行評審

42 引文 斯高帕斯(Scopus)

摘要

TaN-(Ag,Cu) nanocomposite films were deposited by reactive co-sputtering on Si(001). The films were then annealed using RTA (Rapid Thermal Annealing) at 200-400 °C to induce the nucleation and growth of metal particles in TaN matrix and on film surface. After the surface morphologies were analyzed, the samples were tested for their antibacterial behaviors against Gram-negative (Escherichia coli) and Gram-positive (Staphylococcus aureus) bacteria. It is found that the antibacterial efficiency against either E. coli or S. aureus can be much improved for TaN-(Ag,Cu), comparing with TaN-Ag or TaN-Cu films. The annealing temperature for TaN-(Ag,Cu) can be as low as 250 °C. Being annealed at this temperature, the film still shows good antibacterial behaviors against either bacterium. The synergistic effect due to the co-existence of Ag and Cu is obvious, while the films still shows good tribological behaviors.

原文English
頁(從 - 到)160-163
頁數4
期刊Vacuum
87
DOIs
出版狀態Published - 2013

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