Anisotropic thermal conductivity of nano-porous silica film

Bing-Yue Tsui, Chen Chi Yang, Kuo Lung Fang

    研究成果: Conference contribution同行評審

    3 引文 斯高帕斯(Scopus)

    摘要

    In this work thermal conductivity of porous silica film was studied comprehensively. Silica films with porosity from 21% to 64% were spin coated. It is observed for the first time that the porous silica material has strong anisotropic characteristic. The pores in the higher porosity silica film tend to distribute horizontally. This distribution of the pores in the dielectric film is the main factor that induces the anisotropic characteristic. We proposed a Serial-Parallel Hybrid model to explain the correlation between porosity and thermal conductivity in both in-plane and cross-plane components. The anisotropic characteristic of the thermal conductivity may be accompanied by the anisotropic dielectric constant, which will greatly complicate the RC delay simulation of the circuits.

    原文English
    主出版物標題VLSI 2003 - 2003 20th International Symposium on VLSI Technology, Systems and Applications, Proceedings
    發行者Institute of Electrical and Electronics Engineers Inc.
    頁面251-254
    頁數4
    ISBN(電子)0780377656
    DOIs
    出版狀態Published - 2003
    事件20th International Symposium on VLSI Technology, Systems and Applications, VLSI 2003 - Hsinchu, Taiwan
    持續時間: 6 10月 20038 10月 2003

    出版系列

    名字International Symposium on VLSI Technology, Systems, and Applications, Proceedings
    2003-January
    ISSN(列印)1930-8868

    Conference

    Conference20th International Symposium on VLSI Technology, Systems and Applications, VLSI 2003
    國家/地區Taiwan
    城市Hsinchu
    期間6/10/038/10/03

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