Analytic solution to product acceptance determination for gold bumping process with multiple manufacturing lines

W.l. Pearn, Yu Ting Tai, Chia-Huang Wu, Ching Ching Chuang

研究成果: Article同行評審

12 引文 斯高帕斯(Scopus)

摘要

In recent years, gold bumping process has been applied extensively for the package technology of liquid crystal display driver integrated circuit, which is an essential component in portable devices. Because the increasing requirement of high-definition display devices, the gold bumping process has become more difficult and it is requested to be of high quality with very low fraction of defectives. Unfortunately, conventional methods for product acceptance determination no longer work because any sample of reasonable size probably contains no defective gold bump product items. In addition, in the globally competitive manufacturing environment, gold bumping processes involving multiple manufacturing lines are quite common in the Science-Based Industrial Park in Hsinchu, Taiwan, because of economic scale considerations. In this paper, we provide analytical solutions to gold bump product acceptance determination, which provide both manufacturers and customers to reserve their own rights by compromising on a rule for gold bumping process with multiple manufacturing lines. For the convenience of inplant applications, we tabulate the number of required inspection units, the critical acceptance values for various manufacturer's risks and consumer's risks, and various number of manufacturing lines. For illustration purpose, a real application in a gold bumping factory, which is located in the Science-Based Industrial Park in Hsinchu, Taiwan, is included.

原文English
文章編號6606870
頁(從 - 到)1980-1986
頁數7
期刊IEEE Transactions on Components, Packaging and Manufacturing Technology
3
發行號11
DOIs
出版狀態Published - 十一月 2013

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