摘要
The objective of this paper is to analyze mold filling and curing in the Seemann Composite Resin Infusion Molding Process (SCRIMP). Mold filling experiments were carried out to explore the influence of various molding conditions on filling pattern and filling time. Computation models were developed to predict the flow pattern and filling time. In the cure study, a kinetic model based on the free radical polymerization mechanism was developed for simulating the reaction kinetics of a vinyl ester resin. A heat transfer model combined with the kinetic model was solved to simulate the cure behavior in SCRIMP. The effects of room temperature and mold materials on the curing process were discussed.
| 原文 | English |
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| 頁面 | 732-736 |
| 頁數 | 5 |
| 出版狀態 | Published - 1998 |
| 事件 | Proceedings of the 1998 56th Annual Technical Conference, ANTEC. Part 1 (of 3) - Atlanta, GA, USA 持續時間: 26 4月 1998 → 30 4月 1998 |
Conference
| Conference | Proceedings of the 1998 56th Annual Technical Conference, ANTEC. Part 1 (of 3) |
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| 城市 | Atlanta, GA, USA |
| 期間 | 26/04/98 → 30/04/98 |