Analysis of monolithic 3D 6T SRAM using ultra-thin-body InGaAs/Ge MOSFETs considering interlayer coupling

Kuan Chin Yu, Ming Long Fan, Pin Su, Ching Te Chuang

    研究成果: Conference contribution同行評審

    摘要

    TCAD analysis results indicate that the cell robustness and performance of InGaAs-n/Ge-p 6T SRAM can be improved simultaneously with interlayer coupling through optimized monolithic 3D layout design. We suggest two layout designs for high performance and low power operation, respectively. Moreover, with optimized layout designs, InGaAs/Ge 6T SRAM exhibits larger Read access time and Time-to-Write improvement compared with Si-based counterparts.

    原文English
    主出版物標題2015 International Symposium on VLSI Technology, Systems and Applications, VLSI-TSA 2015
    發行者Institute of Electrical and Electronics Engineers Inc.
    ISBN(電子)9781479973750
    DOIs
    出版狀態Published - 3 6月 2015
    事件2015 International Symposium on VLSI Technology, Systems and Applications, VLSI-TSA 2015 - Hsinchu, 台灣
    持續時間: 27 4月 201529 4月 2015

    出版系列

    名字International Symposium on VLSI Technology, Systems, and Applications, Proceedings
    2015-June
    ISSN(列印)1930-8868

    Conference

    Conference2015 International Symposium on VLSI Technology, Systems and Applications, VLSI-TSA 2015
    國家/地區台灣
    城市Hsinchu
    期間27/04/1529/04/15

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