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Analysis of heat transfer and resin reaction
Hung Tzu Chiu
*
, Shih Chou Chen,
L. James Lee
*
此作品的通信作者
生物藥學研究所
研究成果
:
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同行評審
13
引文 斯高帕斯（Scopus）
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Keyphrases
Heat Transfer
100%
Transfer Reactions
100%
Resin Reaction
100%
Two-equation Model
66%
Non-reactivity
33%
Temperature Profile
33%
Resin
33%
Experiment-based
33%
Effective Thermal Conductivity
33%
Numerical Solution
33%
Energy Equation
33%
Non-isothermal
33%
Local Heat Transfer Coefficient
33%
Mold Filling
33%
Fiber Reinforcement
33%
Liquid Composite Molding
33%
Eulerian-Lagrangian Approach
33%
Thermal Dispersion
33%
Thermal Dispersion Effect
33%
Reactive Fluid
33%
Engineering
Equation Model
100%
Thermal Dispersion
100%
Experimental Result
50%
Simulation Result
50%
Good Agreement
50%
Isothermal
50%
Effective Thermal Conductivity
50%
Numerical Solution
50%
Energy Equation
50%
Local Heat Transfer Coefficient
50%
Lagrangian Approach
50%
Mold Filling
50%
Fibre Reinforcement
50%
Liquid Composite Moulding
50%
Temperature Profile
50%
Chemical Engineering
Thermal Conductivity
100%
Heat Transfer Coefficient
100%
Material Science
Thermal Conductivity
100%
Fiber Reinforced Material
100%