Analysis and Prevention on NC-ball induced ESD Damages in a 683-Pin BGA Packaged Chipset IC

Wen Yu Lo*, Ming-Dou Ker

*此作品的通信作者

    研究成果: Conference article › 同行評審

    1 引文 斯高帕斯（Scopus）

    指紋

    深入研究「Analysis and Prevention on NC-ball induced ESD Damages in a 683-Pin BGA Packaged Chipset IC」主題。共同形成了獨特的指紋。

    Keyphrases

    Engineering

    Medicine and Dentistry

    Earth and Planetary Sciences

    Agricultural and Biological Sciences