Analysis and Prevention on NC-ball induced ESD Damages in a 683-Pin BGA Packaged Chipset IC

Wen Yu Lo*, Ming-Dou Ker

*此作品的通信作者

    研究成果: Conference article同行評審

    1 引文 斯高帕斯(Scopus)

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    Keyphrases

    Engineering

    Medicine and Dentistry

    Earth and Planetary Sciences