Analysis and Prevention on NC-ball induced ESD Damages in a 683-Pin BGA Packaged Chipset IC

Wen Yu Lo; Ming-Dou Ker

doi:10.1016/S0026-2714(03)00278-6

Analysis and Prevention on NC-ball induced ESD Damages in a 683-Pin BGA Packaged Chipset IC

Wen Yu Lo^*
, Ming-Dou Ker

^*此作品的通信作者

研究成果: Conference article › 同行評審

1 引文斯高帕斯（Scopus）

摘要

An abnormal failure mechanism due to ESD zapping on the Non-Connected (NC) balls of a 683-pin BGA packaged chipset IC is presented. Failure analyses, including Scanning Electronic Microscopy (SEM) photographs and the measurement of current waveforms during ESD zapping, had been performed with a new proposed equivalent circuit to give clear explanation on this unusual phenomenon. Several methods to prevent such failure mechanism are also discussed.

原文	English
頁（從 - 到）	1583-1588
頁數	6
期刊	Microelectronics Reliability
卷	43
發行號	9-11
DOIs	https://doi.org/10.1016/S0026-2714(03)00278-6
出版狀態	Published - 9月 2003
事件	14th European Symposium on Reliability of Electron Devices, Fa - Bordeaux, France, 法國持續時間: 7 10月 2003 → 10 10月 2003

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10.1016/S0026-2714(03)00278-6

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title = "Analysis and Prevention on NC-ball induced ESD Damages in a 683-Pin BGA Packaged Chipset IC",

abstract = "An abnormal failure mechanism due to ESD zapping on the Non-Connected (NC) balls of a 683-pin BGA packaged chipset IC is presented. Failure analyses, including Scanning Electronic Microscopy (SEM) photographs and the measurement of current waveforms during ESD zapping, had been performed with a new proposed equivalent circuit to give clear explanation on this unusual phenomenon. Several methods to prevent such failure mechanism are also discussed.",

author = "Lo, \{Wen Yu\} and Ming-Dou Ker",

year = "2003",

month = sep,

doi = "10.1016/S0026-2714(03)00278-6",

language = "English",

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pages = "1583--1588",

journal = "Microelectronics Reliability",

issn = "0026-2714",

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note = "14th European Symposium on Reliability of Electron Devices, Fa ; Conference date: 07-10-2003 Through 10-10-2003",

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T1 - Analysis and Prevention on NC-ball induced ESD Damages in a 683-Pin BGA Packaged Chipset IC

AU - Lo, Wen Yu

AU - Ker, Ming-Dou

PY - 2003/9

Y1 - 2003/9

N2 - An abnormal failure mechanism due to ESD zapping on the Non-Connected (NC) balls of a 683-pin BGA packaged chipset IC is presented. Failure analyses, including Scanning Electronic Microscopy (SEM) photographs and the measurement of current waveforms during ESD zapping, had been performed with a new proposed equivalent circuit to give clear explanation on this unusual phenomenon. Several methods to prevent such failure mechanism are also discussed.

AB - An abnormal failure mechanism due to ESD zapping on the Non-Connected (NC) balls of a 683-pin BGA packaged chipset IC is presented. Failure analyses, including Scanning Electronic Microscopy (SEM) photographs and the measurement of current waveforms during ESD zapping, had been performed with a new proposed equivalent circuit to give clear explanation on this unusual phenomenon. Several methods to prevent such failure mechanism are also discussed.

UR - https://www.scopus.com/pages/publications/0042193291

U2 - 10.1016/S0026-2714(03)00278-6

DO - 10.1016/S0026-2714(03)00278-6

M3 - Conference article

AN - SCOPUS:0042193291

SN - 0026-2714

VL - 43

SP - 1583

EP - 1588

JO - Microelectronics Reliability

JF - Microelectronics Reliability

IS - 9-11

T2 - 14th European Symposium on Reliability of Electron Devices, Fa

Y2 - 7 October 2003 through 10 October 2003

ER -

Analysis and Prevention on NC-ball induced ESD Damages in a 683-Pin BGA Packaged Chipset IC

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