Analysis and Prevention on NC-ball induced ESD Damages in a 683-Pin BGA Packaged Chipset IC

Wen Yu Lo*, Ming-Dou Ker

*此作品的通信作者

    研究成果: Conference article同行評審

    1 引文 斯高帕斯(Scopus)

    摘要

    An abnormal failure mechanism due to ESD zapping on the Non-Connected (NC) balls of a 683-pin BGA packaged chipset IC is presented. Failure analyses, including Scanning Electronic Microscopy (SEM) photographs and the measurement of current waveforms during ESD zapping, had been performed with a new proposed equivalent circuit to give clear explanation on this unusual phenomenon. Several methods to prevent such failure mechanism are also discussed.

    原文English
    頁(從 - 到)1583-1588
    頁數6
    期刊Microelectronics Reliability
    43
    發行號9-11
    DOIs
    出版狀態Published - 9月 2003
    事件14th European Symposium on Reliability of Electron Devices, Fa - Bordeaux, France, France
    持續時間: 7 10月 200310 10月 2003

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