TY - JOUR
T1 - Analysis and Prevention on NC-ball induced ESD Damages in a 683-Pin BGA Packaged Chipset IC
AU - Lo, Wen Yu
AU - Ker, Ming-Dou
PY - 2003/9/1
Y1 - 2003/9/1
N2 - An abnormal failure mechanism due to ESD zapping on the Non-Connected (NC) balls of a 683-pin BGA packaged chipset IC is presented. Failure analyses, including Scanning Electronic Microscopy (SEM) photographs and the measurement of current waveforms during ESD zapping, had been performed with a new proposed equivalent circuit to give clear explanation on this unusual phenomenon. Several methods to prevent such failure mechanism are also discussed.
AB - An abnormal failure mechanism due to ESD zapping on the Non-Connected (NC) balls of a 683-pin BGA packaged chipset IC is presented. Failure analyses, including Scanning Electronic Microscopy (SEM) photographs and the measurement of current waveforms during ESD zapping, had been performed with a new proposed equivalent circuit to give clear explanation on this unusual phenomenon. Several methods to prevent such failure mechanism are also discussed.
UR - http://www.scopus.com/inward/record.url?scp=0042193291&partnerID=8YFLogxK
U2 - 10.1016/S0026-2714(03)00278-6
DO - 10.1016/S0026-2714(03)00278-6
M3 - Conference article
AN - SCOPUS:0042193291
SN - 0026-2714
VL - 43
SP - 1583
EP - 1588
JO - Microelectronics and Reliability
JF - Microelectronics and Reliability
IS - 9-11
T2 - 14th European Symposium on Reliability of Electron Devices, Fa
Y2 - 7 October 2003 through 10 October 2003
ER -