@inproceedings{4267e8b7d26546d5a355fa7ee98ca881,
title = "An ultra-high-density 256-channel/25mm2 neural sensing microsystem using TSV-embedded neural probes",
abstract = "Highly integrated neural sensing microsystems are crucial to capture accurate signals for brain function investigations. In this paper, a 256-channel/25 mm2 neural sensing microsystem is presented based on through-silicon-via (TSV) 2.5D integration. This microsystem composes of dissolvable μ-needles, TSV-embedded μ-probes, 256-channel neural amplifiers, 11-bit area-power-efficient SAR ADCs and serializers. Based on the dissolvable μ-needles and TSV 2.5D integration, this microsystem can detect 256 ECoG/LFP signals within the small area of 5mm × 5mm. Additionally, the neural amplifier realizes 57.8dB gain with only 9.8μW for each channel, and the 9.7-bit ENOB of the SAR ADC at 32kS/s can be achieved with 0.42μW and 0.036 mm2. The overall power of this microsystem is only 3.79mW for 256-channel neural sensing.",
author = "Huang, {Yu Chieh} and Po-Tsang Huang and Wu, {Shang Lin} and Hu, {Yu Chen} and You, {Yan Huei} and Ming Chen and Huang, {Yan Yu} and Chang, {Hsiao Chun} and Lin, {Yen Han} and Jeng-Ren Duann and Tzai-Wen Chiu and Wei Hwang and Kuan-Neng Chen and Ching-Te Chuang and Jin-Chern Chiou",
note = "Publisher Copyright: {\textcopyright} 2016 IEEE.; 2016 IEEE International Symposium on Circuits and Systems, ISCAS 2016 ; Conference date: 22-05-2016 Through 25-05-2016",
year = "2016",
month = jul,
day = "29",
doi = "10.1109/ISCAS.2016.7527487",
language = "English",
series = "Proceedings - IEEE International Symposium on Circuits and Systems",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "1302--1305",
booktitle = "ISCAS 2016 - IEEE International Symposium on Circuits and Systems",
address = "美國",
}