@inproceedings{0101cc2b02e04375a3d5adf397c11d45,
title = "An implantable 128-channel wireless neural-sensing microsystem using TSV-embedded dissolvable μ-needle array and flexible interposer",
abstract = "For implanted neural-sensing devices, one of the remaining challenges is to transmit stable power/data (P/D) transmission for high spatiotemporal resolution neural data. This paper presents a miniaturized implantable 128-channel wireless neural-sensing microsystem using TSV-embedded dissolvable μ-needle array, a flexible interposer and 4 dies by 2.5D/3D TSV heterogeneous SiP technology. The 4 dies are 2 neural-signal acquisition ICs implemented by 90nm CMOS, 1 neural-signal processor by 40nm CMOS and 1 wireless P/D transmission circuitry by 0.18μm CMOS. Thus, the proposed wireless microsystem realizes 128-channel neural-signal sensing within the area of 5mm × 5mm, neural feature extraction and wireless P/D transmission using an on-interposer inductor. The overall average power of the circuits in this microsystem is only 9.85mW.",
author = "Po-Tsang Huang and Huang, {Yu Chieh} and Wu, {Shang Lin} and Hu, {Yu Chen} and Lu, {Ming Wei} and Sheng, {Ting Wei} and Chang, {Fung Kai} and Lin, {Chun Pin} and Chang, {Nien Shang} and Chen, {Hung Lieh} and Chen, {Chi Shi} and Jeng-Ren Duann and Tzai-Wen Chiu and Wei Hwang and Kuan-Neng Chen and Ching-Te Chuang and Jin-Chern Chiou",
note = "Publisher Copyright: {\textcopyright} 2017 IEEE.; 50th IEEE International Symposium on Circuits and Systems, ISCAS 2017 ; Conference date: 28-05-2017 Through 31-05-2017",
year = "2017",
month = sep,
day = "25",
doi = "10.1109/ISCAS.2017.8050687",
language = "English",
series = "Proceedings - IEEE International Symposium on Circuits and Systems",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "1--4",
booktitle = "2017 IEEE INTERNATIONAL SYMPOSIUM ON CIRCUITS AND SYSTEMS (ISCAS)",
address = "美國",
}