An Embedded Multi-Die Active Bridge (EMAB) Chip for Rapid-Prototype Programmable 2.5D/3D Packaging Technology
Jie Zhang, Wei Lu, Po Tsang Huang, Sih Han Li, Tsung Yi Hung, Shih Hsien Wu, Ming Ji Dai, I. Shan Chung, Wen Chao Chen, Chin Hung Wang, Shyh Shyuan Sheu, Hung Ming Chen, Kuan Neng Chen, Wei Chung Lo, Chih I. Wu
研究成果: Conference contribution › 同行評審
4
引文
斯高帕斯（Scopus）